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 Features:
Combine Part A (resin) and
Part B (hardener) in the correct ratio,
and mix thoroughly until the color and
consistency are uniform.
Classify:
1. Room
temperature cure Epoxy: Complete cure is
obtained after 24 hours at room
temperature after mixing.
2. Heat cure Epoxy: Heat after mixing to
shorten the curing time.
3. Single component heat cure Epoxy:
Single component, reaction will occur
after heating |
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Click on the "grades" you are interested in, they will be added to the inquiry list
automatically.. (Click here to send out the inquiry. )
|
Grade |
Color
|
Viscosity CPS |
Rigidity
(shore) |
Material |
Soliditfy |
Water absorption rate |
Feature |
|
CH6611 |
Thixotropy |
25000~
1400000 |
D80 |
PCB |
150°C
/ 90secs |
- |
Thixotropy, ideal for SMT adhesion (for brush). |
|
CH6689 |
Thixotropy |
650000 |
D80 |
PCB |
150°C/90secs |
- |
Thixotropy, ideal for SMT adhesion (for dispense) |
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CMOS Adhesion Series│Underfill
Adhesion Series│Metal
Adhesion Series│COB
Encapsulation Series
SMT
Adhesion Series│Peculiar
Adhesion Series |
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