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Broswse By Application

   

Features:
Combine Part A (resin) and Part B (hardener) in the correct ratio, and mix thoroughly until the color and consistency are uniform.
 

Classify:
1. Room temperature cure Epoxy: Complete cure is obtained after 24 hours at room temperature a
fter mixing.
2. Heat cure Epoxy: Heat after mixing to shorten the curing time.
3. Single component heat cure Epoxy: Single component, reaction will occur after heating

 

Click on the "grades" you are interested in, they will be added to the inquiry list automatically.. (Click here to send out the inquiry. )

Grade

Color

Viscosity CPS

Rigidity
(shore)

Material

Soliditfy

Water absorption rate

Feature

CH6611

Thixotropy

25000~

1400000

D80

PCB

150C / 90secs

-

Thixotropy, ideal for SMT adhesion (for brush).

CH6689

Thixotropy

650000

D80

PCB

150C/90secs

-

Thixotropy, ideal for SMT adhesion (for dispense)

 

 

CMOS Adhesion SeriesUnderfill Adhesion SeriesMetal Adhesion SeriesCOB Encapsulation Series

SMT Adhesion SeriesPeculiar Adhesion Series

 
 

EVOTITE ADHESIVES CO., LTD.

China

TEL: 86-750-5623286

FAX: 86-750-5620116

TaiWan:

TEL: 886-7-6430866

FAX: 886-7-6410501

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