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Broswse By Application

   

Features:
Combine Part A (resin) and Part B (hardener) in the correct ratio, and mix thoroughly until the color and consistency are uniform.
 

Classify:
1. Room temperature cure Epoxy: Complete cure is obtained after 24 hours at room temperature after mixing.
2. Heat cure Epoxy: Heat after mixing to shorten the curing time.
3. Single component heat cure Epoxy: Single component, reaction will occur after heating

 
 

Click on the "grades" you are interested in, they will be added to the inquiry list automatically.. (Click here to send out the inquiry. )

Grade

Color

Viscosity CPS

Rigidity
(shore)

Material

Position

Soliditfy

 Water absorption rate

Feature

EX264

Black

4200

D44

 CSP(FBGA),BGA

120C/20min

0.9

Compare to Loctit 3505, fast setting, reworkable.

EX265

Transparence

3100

D55

CSP(FBGA),BGA

120C/20min

1.4

Excellent soft after cured, low thermal stress, reworkable

EX500

Black

1600

D80

CSP(FBGA),BGA

120C/20min

1.3

Excellent soft after cured, low thermal stress, reworkable.

EX450

Black

2000

D40

CSP(FBGA),BGA

120C/20min

0.93

Excellent soft after cured, low thermal stress, condensate.

 

 

 

CMOS Adhesion SeriesUnderfill Adhesion SeriesMetal Adhesion SeriesCOB Encapsulation Series

SMT Adhesion SeriesPeculiar Adhesion Series

 
 

EVOTITE ADHESIVES CO., LTD.

China

TEL: 86-750-5623286

FAX: 86-750-5620116

TaiWan:

TEL: 886-7-6430866

FAX: 886-7-6410501

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