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Features:
Combine Part A (resin) and Part B (hardener) in the correct ratio, and mix thoroughly until the color and consistency are uniform.
 

C-MOS MODULE

 

Classify:
1. Room temperature cure Epoxy: Complete cure is obtained after 24 hours at room temperature after mixing.
2. Heat cure Epoxy: Heat after mixing to shorten the curing time.
3. Single component heat cure Epoxy: Single component, reaction will occur after heating

 

 

 

Click on the "grades" you are interested in, they will be added to the inquiry list automatically.. (Click here to send out the inquiry. )

 

Grade

Color

Viscosity CPS

Shores

Using time @25℃

Soliditfy

Rigidity (shore)

Feature

EX6010

Black

7000

D80

Plastic VS Glass FR4 FPC

70C/30mins

1.8

Ideal for bonding CMOS lens holder and PCB.

EX6020

Black

45000

D82

Plastic VS Glass FR5 FPC

60C/1hr

1.8

Ideal for bonding CMOS lens holder and PCB.

EX6030

Black

45000

D80

Plastic VS FPC (LCP)

60C/1hr

1.7

Ideal for bonding CMOS lens holder and flexible PCB.

EX6060

Black

14000

D82

Plastic VS Fr4

70C/30mins

1.9

Ideal for bonding CMOS lens holder and flexible PCB.

 

 

CMOS Adhesion SeriesUnderfill Adhesion SeriesMetal Adhesion SeriesCOB Encapsulation Series

SMT Adhesion SeriesPeculiar Adhesion Series

 
 

EVOTITE ADHESIVES CO., LTD.

China

TEL: 86-750-5623286

FAX: 86-750-5620116

TaiWan:

TEL: 886-7-6430866

FAX: 886-7-6410501

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